Desktop reflow oven QR962C Maximum Soldering Area： 400*600 mm
Description
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Description
The QRF1230 infrared benchtop reflow oven is bigger size than QRF830 model SMT Reflow Oven solder welding .Which uses the PID temperature control system and rapid infrared heating technology controlling, so the temperature is being kept very accurate and evenly distributed. The whole soldering process can be completed automatically and it is very easy to use. It is suitable for the board has chips and output is larger or the welding quality requirements are better.Designed with Multi-temperature curve choose.Four zones special temperature control mode more stable and precise.High quality thermocouple porcelain bead protect.Full-color HMI human-computer interface(touch screen).Super anti-temperature fan.Liner hearth use industrial grade anti high temperature and corrosion panel paint.PID microcomputer global temperature control system. High efficiency and energy saving finned heating tube.High temperature fan.Built in analog governor.
ModelQRF1230Heat zone numbers12 zones(Up6, Down6)Heat methodHot windCooling zone numbersTwo natural air coolingLength of heating zone2080mmWidth of net belt300mmPCB size280mmHeight of net belt900±20mmTransport speed of net belt160~1350mm/min(Analog quantity adjusting)Transport direction of net beltLeft to right( right to left)Starting power14KWWorking power5KWInput supply powerThree-phase five-wire 380±10% 50HZHeat up timeAbout 20 minsTime of passing through the machine3.5 to 5.5 minsRange of temperature controlIndoor temperature to 400 degrees PID Closed-loop ControlMethod of temperature controlPID close cycle controlNet weight430kgOutline size3500x730x1265mm
