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Bagaj Yuvarlanan Fıçısı Drop Etki Test Makinesi, Çantalar ve Valizler için Dumble Etki Testi
Luggage Tumbling Barrel Drop Impact Testing Machine, Tumble Impact Testing for Bags and Suitcases Model NG-344 MOQ 1 Set Lead Time 3-15 Working Days Country...
Bally deri dinamik su geçirmez test cihazı, deri ayakkabılar dinamik su geçirmez test makinesi
Bally Leather Dynamic Waterproof Tester, Leather Shoes Dynamic Waterproof Test Machine Model NG-375 MOQ 1 Set Lead Time 3-15 Working Days Country of Origin China...
Bally deri düşük sıcaklıkta esneme test cihazı, deri düşük sıcaklık esneme test cihazı
Bally Leather Low Temperature Flexing Tester, Leather Low Temperature Flexing Tester Model NG-348 MOQ 1 Set Lead Time 3-15 Working Days Country of Origin China...
Bally deri düşük sıcaklıkta esneme test cihazı, düşük sıcaklıklı ayakkabılar bükme test cihazı
描述 Temp. Range Room temp. ~ – 40℃ Control precision ±0.3℃ Uniformity ±0.1℃ Cooling Speed Within 50 min (approx.) Refrigeration System Single stage, hermetic compressor...
Bally deri esneme test cihazı
Bally Leather Flexing Tester Model NG-327 MOQ 1 Set Lead Time 3-15 Working Days Country of Origin China Package Standard Export Wooden Box OEM &...
Bant Dağıtıcı – Doğrusal Yem Sürümü Iwm -1000
Specification Features • Automatic cutter and tape feed • Digital length adjustment • Adjustable pressure feed to help prevent curling of tape • Manual override...
Basit yerleştirme ve ekstraksiyon ömrü test cihazı, konektör fiş ekleme ömrü test makinesi
Simple Insertion and Extraction Life Tester, Connector Plug Insertion Lifetime Testing Machine Model NG-213 MOQ 1 Set Lead Time 3-15 Working Days Country of Origin...
Bekk kağıt pürüzsüzlük ve yüzey pürüzlülüğü test makinesi
Bekk Paper Smoothness and Surface Roughness Testing Machine Model NG-615 MOQ 1 Set Lead Time 3-15 Working Days Country of Origin China Package Standard Export...
BGA Rework IR Lehimleme İstasyonu T-835
BGA Rework Station T-835 Adopts hand-held lamp structure with flexible operation and easy control. Suitable for any angle of flat components, especially BGA, SMD components desoldering.
BGA Rework İstasyonu T-862
Infrared heating without air flow. Won’t impact perimeter small components. Can desolder all of the SMD components,especially Micro BGA components. Repair chips size 15×15-25×25 mm Rated voltage and...
BGA Rework İstasyonu T-862++
Infrared heating without air flow. Won’t impact perimeter small components. Can desolder all of the SMD components,especially Micro BGA components.
